Lead tin, solder alloy Pb:Sn - 50:50 %, Ø 3.18 mm (0.125 in)
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Danger
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CAAA41023-29EA
126.7
CAD
CAAA41023-29
CAAA41023-TB
Lead tin, solder alloy Pb:Sn - 50:50 %, Ø 3.18 mm (0.125 in)
Lead tin, solder alloy
For use with copper, copper alloys, lead, steel, and nickel alloys. Recommended for light electrical wiring
Melting temperature range: 182-273°
Molecular Formula: Pb:Sn; 50:50 wt%
MDL No.: MFCD00798549
Applications: For use with copper, copper alloys, lead, steel, and nickel alloys. Recommended for light electrical wiring
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