Glennel Diamond Compound Paste, Electron Microscopy Sciences

Supplier: Electron Microscopy Sciences
50370-51 50370-41 50370-40 50370-21 50370-70 50371-50 50371-80 50370-10 50371-30 50371-10 50370-71 50371-70 50370-50 50370-60 50370-91 50370-30 50370-31 50371-20 50370-61 50371-40 50370-81 50371-60 50370-20 50370-80 50370-11
100497-296EA 88.4 CAD
100497-294 100497-274 100497-296 100497-298 100497-276 100497-332 100497-278 100497-312 100497-316 100502-448 100497-280 100497-282 100497-284 100497-286 100497-320 100497-288 100497-300 100497-324 100497-302 100497-304 100502-450 100497-328 100497-306 100497-290 100497-292
Glennel Diamond Compound Paste, Electron Microscopy Sciences
Polishers and Tumblers
Glennel® UC Formulation is an oil soluble compound recommended for finishing wire dies, molds, cold heading dies, and general shop applications where diamond compounds are required.

  • Provides fast cutting action and superior finish
  • Meant to be used with Formula C extender for maximum efficiency

Glennel® UB Formulation is excellent for most applications where a diamond compound is desired. It is soluble in either water or oil and works with all common extenders. UB compound is recommended for polishing laboratory specimens and lapping of materials such as carbide, ceramic, sapphire, composites, ferrite, and silicon.

Glennel® OS Formulation is an oil soluble compound designed for lapping large areas of hard material. Use alone or with an extender it cleans up easily, provides aggressive stock removal and an outstanding finish.

All Diamond Pastes are available as a standard in 5 g size dispensing tube UB or UC and UBS or UCS.

Ordering information: 18 g sizes are available upon request.
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